| Projekt | Ynhâld | Capabibty |
| 1 | board klassifikaasje | Aluminiumbasis, koperbasis, keramykbasis koper, kombineare badboard |
| 2 | materiaal | Domestic Aluminium.Domestic koper, Ymportearre aluminium, Ymportearre koper |
| 3 | oerflak behanneling | HASL/ENIG/OSP/sikering |
| 4 | laach account | single-sided pnnted board / double-sided printe board |
| 5 | maxi.Board Grutte | 1200mm*480m(n |
| 6 | min.Board Grutte | 5mm * 5mm |
| 7 | line breedte / apsce | 0.1mnV0.1mm |
| 8 | warp en twist | <=0.5%(tfiickness: 1 .Omm, Board Grutte: 300mm*300mm) |
| 9 | board dikte | 0.5mm-5.0mm |
| 10 | koper folie dikte | 35urrV70um/105um/140um/175unV210um/245um/280um/315um/35Qjm |
| 11 | tolerânsje | CNC-routing: ± 0,1 mm; pons: 士 0,1 mm |
| 12 | V-CUT registraasje | ± 0,1 mm |
| 13 | Hole muorre koper dikte | 20u-35u |
| 14 | Mm registraasje fan gatposysje (campare mei CAD-gegevens) | ± 3 mil (10.076 mm) |
| 15 | Min.punching gat | 1.0mm (Board dikte bebw 1.0mmr1.0mm) |
| 16 | Min.punching fjouwerkant slot | (Boarddikte ûnder 1 .Omm, 1.0mm* 1.Omm) |
| 17 | Registraasje fan printe circuit | ± 0.076 mm |
| 18 | Min. drill gat diameter | 0,6 mm |
| 19 | dikte fan oerflak behanneling | plating goud: Ni 4um-6um> Au0.1um-0.5umENIG: Ni 5um-6um, Au: 0.0254um-0.127umsulvering: Ag3um-8umHASL: 40um-1 OOum |
| 20 | V-CUT-graad tolerânsje | (Graad) |
| 21 | V-CUT board dikte | 0.6mm-4.0mm |
| 22 | Min.legend breedte | 0,15 mm |
| 23 | Min.Soldor masker iepening | 0.35 mm |