Competitive PCB Fabrikant

Items Bekwamens
Laach telle 1-40 laach
Laminaten type FR-4 (hege Tg, halogeenfrij, hege frekwinsje)
FR-5, CEM-3, PTFE, BT, Getek, Aluminium base, Koper base, KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon
Board dikte 0.2mm-6mm
Max Basis koper gewicht 210um (6oz) foar binnenste laach 210um (6oz) foar bûtenste laach
Min meganyske drill grutte 0.2mm (0.008")
Aspect ratio

12:01

Max paniel grutte Sigle kant of dûbele kanten: 500mm * 1200mm,
Mearlaach lagen: 508 mm X 610 mm (20" X 24")
Min line breedte / romte 0.076mm / 0.0.076mm (0.003" / 0.003")
Via gat type Blind / Burried / Plugged (VOP, VIP ...)
HDI / Microvia JA
Oerflakte ôfwurking HASL
Lead Free HASL
Immersion Gold (ENIG), Immersion Tin, Immersion Silver
Organic Solderability Preservative (OSP) / ENTEK
Flash Gold (Hard Gold plating)
ENEPIG
Selektyf gouden plating, gouddikte oant 3um (120u")
Gouden Finger, Carbon Print, Peelable S/M
Solder masker kleur Grien, blau, wyt, swart, dúdlik, ensfh.
Impedânsje Single trace, differinsjaal, coplanar impedance kontrolearre ± 10%
Outline finish type CNC Routing;V-Scoring / Cut;Punch
Tolerânsjes Min Hole tolerance (NPTH) ± 0,05 mm
Min Hole tolerance (PTH) ± 0.075 mm
Min Pattern tolerânsje ± 0,05 mm
Max PCB grutte 20 inch * 18 inch
Min PCB grutte 2 inch * 2 inch
Board dikte 8 mil-200 mil
Komponinten grutte 0201-150 mm
Komponint max hichte 20 mm
Min lead pitch 0,3 mm
Min BGA bal pleatsing 0,4 mm
Pleatsing presyzje +/- 0,05 mm
Tsjinsten Range Materiaal oankeap en behear
PCBA pleatsing
PTH komponinten soldering
BGA re-bal en X-ray ynspeksje
ICT, Funksjonele testen en AOI-ynspeksje
Fabrication fan Stencil