| Max PCB grutte | 20 inch * 18 inch |
| Min PCB grutte | 2 inch * 2 inch |
| Board dikte | 8 mil-200 mil |
| Komponinten grutte | 0201-150 mm |
| Komponint max hichte | 20 mm |
| Min lead pitch | 0,3 mm |
| Min BGA bal pleatsing | 0,4 mm |
| Pleatsing presyzje | +/- 0,05 mm |
|
Tsjinsten Range | Materiaal oankeap en behear |
| PCBA pleatsing | |
| PTH komponinten soldering | |
| BGA re-bal en X-ray ynspeksje | |
| ICT, Funksjonele testen en AOI-ynspeksje | |
| Fabrication fan Stencil |